Pad Surface Roughness and Slurry Particle Size Distribution Effects on Material Removal Rate in Chemical Mechanical Planarization
نویسندگان
چکیده
منابع مشابه
Effects of Surface Forces on Material Removal Rate in Chemical Mechanical Planarization
In chemical mechanical planarization, abrasive particles are pushed onto a wafer by a deformable pad. In addition to the pad–particle contact force, surface forces also act between the wafer and the particles. Experimental studies indicate the significance of slurry pH and particle size on the material removal rate MRR . In this work, a model for MRR, including the contact mechanics of multiple...
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A material removal rate (MRR) model as a function of abrasive weight concentration has been proposed for chemical mechanical planarization/polishing (CMP) by extending a material removal model developed earlier in 2001 and 2002. With an increase of the weight concentration of abrasives, three regions of material removal exist: a chemically dominant and rapid increasing region, a mechanically do...
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Introduction The Chemical Mechanical Planarization (CMP) process plays a key role in the manufacture of data storage, video display panels, and semiconductor chips. The process combines the chemical (acidic or basic) effect of the slurry, which contains micro-abrasives with the mechanical effect provided by polishing to reduce the topography on the wafer or rigid disk substrate. The process for...
متن کاملEffects of Abrasive Size Distribution in Chemical Mechanical Planarization: Modeling and Verification
Recently, a comprehensive model has been developed by Luo and Dornfeld (“Material removal mechanism in chemical mechanical polishing: theory and modeling,” IEEE Trans. Semiconduct. Manufact., vol. 14, pp. 112–133, May 2001) to explain the material removal mechanism in chemical mechanical planarization (CMP). Based on the model, the abrasive size distribution influences the material removal from...
متن کاملPad conditioning in chemical mechanical polishing: a conditioning density distribution model to predict pad surface shape
Abstract: Diamond disc pad conditioning is traditionally employed to restore pad planarity and surface roughness in chemical mechanical polishing (or planarisation) (CMP). In this paper, a conditioning density distribution model is developed to predict the pad surface shape resulted from the diamond disc conditioning in CMP. A kinematic study is carried out to calculate and simulate the diamond...
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ژورنال
عنوان ژورنال: CIRP Annals
سال: 2005
ISSN: 0007-8506
DOI: 10.1016/s0007-8506(07)60110-3